Strategische programma's | 2024 - 2027
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SMART-LIBS
Simulation-based Material Analysis for RepresenTative LIBS technology
BRIDGE
Bridging AI Materials Design to Advanced Lab Automation
PROJECTION II
MEMS-Based Projection Column for Multimodal Light-Electron Integrated SEM
SACD4HTS
Secure-by-Design Autonomous Cyber Defense in High Tech System
Actie
Advanced data Converter Techniques for Imagers
SaViSO
Satellite Virtualization for Smart Oper-ations
PET4DC
Intelligent Power Electronics Transformers for Data Centers
UltraCool
Unlocking Ultra-Efficient Electronics Cooling Through 3D Printing: Bringing Coolant Closer to the Hotspot in Advanced Packaging
DPS-EPIR
Dynamic protection of surfaces exposed to plasma and ionizing radiation
ImmunoCaps
Immuno-OCT Capsule Camera
PoBot
Towards Embodied AI-Driven Excrement Disposal in ICUs
Bonsai
Bonding by Surface Activation
ReLub (deel 2)
Optimizing machinery lifetime and maintenance by effective relubrication (deel 2)
Smart Connect
New environmentally friendly generic approach for advanced die connection in Chip Packaging
LSP-BOND
Light‑Speed Precision Bonding