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Talos 2027&2028
Talos 2027&2028
WADI
Wavelength-multiplexing for high-throughput ultraclean wafer dicing
SMART-LIBS
Simulation-based Material Analysis for RepresenTative LIBS technology
H2NANO
Operando Nanoscale Insights for Hydrogen Catalysts
Q-INSPECT
Quantum INSitu Performance and Error Characterization Technology
SOFT-PACK
Sustainable and Functional 3D Technology for Packaging of Adaptive Chip-Connected implants
WEEDLESS-AQUATIC-DRONE
Robuuste voortstuwing en autonomie voor aquatische drones in complexe ondiepe wateren
NewQISontheBlox
Challenging Qblox electronics to improve quantum error correction with superconducting processors
SPaCE-DP
Scalable Payload Control Engine and Data Processor
BRIDGE
Background Report Inference and Description with Generative EEG
VISTA-3D
Volumetric Imaging for Semiconductor Technology Advancement
RAM
Innovatieve Geopolymeer-gebaseerde Radar Absorberende Coatings
Glueless
Hermetic packaging* of microfluidic sensor chips without glue or elastomers for ventilators and multi-infusion systems
SEPIS
Systems Engineering for Physics Intensive Systems
PROJECTION II
MEMS-Based Projection Column for Multimodal Light-Electron Integrated SEM