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Pre-announcement: HTSM Call 2026

17 June 2026

NWO and Holland High Tech are currently preparing a new HTSM Call: 3D integration technologies and sustainable systemic design techniques for future semiconductor devices. The call focuses on funding fundamental and applied research in the field of 3D integration technologies and sustainable systemic design techniques. The call is expected to open in Q4 of 2026.

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Semiconductor Technologies

The HTSM call is a joint research programme run by NWO and Holland High Tech that funds research in the field of High-Tech Systems and Materials. The programme focuses on key technologies required for major societal transitions, such as the energy transition, the circular economy and digitalisation.

Focus: two challenges facing the semiconductor equipment industry

The new call focuses on two closely related areas of research:

The first challenge concerns the rise of 3D integration, which calls for a new generation of mechatronic equipment. Extremely high precision, extensive integration of process steps and shorter development cycles are crucial here, combined with cost control through modularity and scalable platforms.

The second challenge centres on sustainability and the use of critical materials. This calls for solutions involving circular design, the reuse of components and the reduction in the use of strategic raw materials, without compromising on reliability and cost-effectiveness. New design, testing and life-cycle methods, supported by data and digital twins, play a key role in this.

Budget and co-funding

NWO and Holland High Tech are jointly making €6 million available. Participation requires at least two co-funders, who together must contribute at least 20 per cent of the total project budget, either in cash or in kind.

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