PMEC

Plasma Material Testing under Extreme Conditions

ASML is pushing the limits of their latest generation of EUV scanners by increasing EUV source power, thus reducing the cost of goods. One of the approaches taken by ASML is to increase source repetition rate. As a result scanners will use more tin. A downside of this is that also more tin escapes through the intermediate focus toward the illuminator section of the scanner, where it will cause mirror reflection loss and contributes to particle contamination.

Chosen direction

ASML is looking into introducing a dynamic barrier between the source and the optics. The position of this barrier is in a very harsh environment for materials to withstand. It includes high plasma loads, high temperatures and high mechanical loads.

Current status of the technology

Various offline test setups at TNO are available to test the influence of hydrogen radicals, hydrogen plasma and EUV on materials. In the outside world test benches are available that can test mechanical properties of materials under high temperature and dynamic stresses. However, the industry is lacking test facilities that can test in a hydrogen plasma environment while simultaneously the material is exposed to high temperatures and varying mechanical stresses.

Future challenge

TNO currently has experience and setups to tests materials under various plasma conditions. The extension towards the combination of plasma load under high temperature and under dynamic load is a challenge which TNO is eager to take on.

Facts & figures

Scheme: PPS-I Strategische Programma's
Programme: Semiconductor Manufacturing Equipment | 2024-2027
Total budgeted project costs: € 400.000,00
Project start date: 30 January 2026
Project end date: 31 December 2027

Project managers

Leon Arkesteijn

Project consortium

TNO ASML

Innovatiedomein

Semiconductor Technologies

Sleuteltechnologie

Construction and structural materials

Urgent transitions

Sleuteltechnologieën

kennis-en-innovatie-agenda

Sleuteltechnologieën