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Laser4Packaging

Laser-micro welding for Advanced Packaging—sealing of dissimilar materials in micro-fluidic sensors

Current MEMS-based sensor packaging typically uses adhesive or solder bonding to metal or ceramic substrates, which limits compatibility with various fluids and restricts sensor applications. These conventional materials also require strict process control during manufacturing to ensure reliability.

To overcome these issues, new packaging methods and materials are needed that provide hermetic, leak-tight, and pressure-resistant interfaces suitable for both liquids and gases. Elastomer sealing has been explored, but PFAS-based compounds make it environmentally unsustainable.

A major challenge lies in joining MEMS sensors to dissimilar, brittle materials with mismatched thermal expansion properties. Developing reliable bonding techniques requires in-depth understanding of material behavior, along with extensive validation through thermal cycling and failure analysis. Achieving this would broaden the application range of MEMS sensors, enabling multi-parameter sensing and advanced packaging solutions, particularly for Bronkhorst technologies.

The project proposes using (ultra) short laser pulses—femtosecond to nanosecond—to achieve precise, strong, and reliable bonds between dissimilar materials. Laser-based methods offer automation, accuracy, and repeatability, making them ideal for scalable manufacturing. Collaboration between the University of Twente’s Laser Processing group and Bronkhorst combines advanced laser research capabilities with decades of MEMS expertise.

Facts & figures
  • Scheme: PPS-I Strategische Programma's
  • Programme: Advanced Chip Packaging | 2025-2027
  • Total budgeted project costs: € 677.000,00
  • Project start date: 1 March 2026
  • Project end date: 28 February 2029
Project managers
Project consortium
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