INOCAP
Innovative Nanoimprinting with Overlay Controlled for Advanced Packaging
The INOCAP project develops a new generation nano‑imprint lithography (NIL) machine for advanced semiconductor packaging. In a joint study by Morphotonics and TNO, an imprint concept is being designed and tested with improved process stability and reduced deformation for panels up to 700×700 mm. Hereby a prototype will be developed with ±1 µm overlay accuracy, essential for cost‑efficient, low‑waste high‑volume chip production.
Background
The growing demand for computing power requires new manufacturing technologies for advanced semiconductor packaging. Nano‑imprint lithography (NIL) offers a scalable and cost‑efficient alternative, but is currently limited by insufficient overlay accuracy and process control. In this project, Morphotonics and TNO are developing a renewed roll‑to‑plate imprint concept that combines system analysis, modeling, and experimental validation to intrinsically reduce deformations. The result is a prototype with improved reproducibility and a clear path toward ±1 µm overlay accuracy. This marks an important step toward applying NIL in panel‑level semiconductor manufacturing and strengthening the Dutch position in advanced packaging technologies.