ECoH
Electrical Connections of High-Density for Quantum Devices
Quantum technology often requires a large number of signals to control and operate hundreds or thousands of quantum bits inside a very cold cryostat, while maintaining quality, time, scalability and repeatability.
This bottleneck can be mitigated by optimising input/output components (wiring, interfaces, connectors, thermal clamps, chip carriers) to accelerate the R&D process. It is precisely these bottlenecks that our project aims to overcome.