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Innovation Mission to Germany: integrated photonics and advanced packaging

8 May 2026

From 28 September to 2 October 2026, the Netherlands Enterprise Agency is organising an innovation mission to Germany. The mission focuses on integrated photonics and advanced packaging, making it particularly relevant to the Dutch photonics and semiconductor community. Registration is open until 22 May 2026.

News
Optical Systems & Integrated Photonics
Semiconductor Technologies

The mission will visit two leading regions in Germany’s high-tech landscape: Saxony and Berlin-Brandenburg. Saxony is Europe’s largest semiconductor manufacturing hub, accounting for around a third of all chips produced in Europe. Berlin-Brandenburg is home to a high concentration of photonics companies, research institutions and innovation organisations, including the renowned OptecBB photonics cluster.

Participants will visit leading companies and research institutes in the field of integrated photonics and advanced packaging. In addition to formal visits, joint transfers and networking dinners are planned to encourage informal exchanges and foster lasting relationships. Exploring opportunities for collaboration with major German projects, such as the APECS Fraunhofer Pilot Line, is also on the agenda.

Further information and registration

This mission is aimed at Dutch entrepreneurs, researchers and innovators working in the semiconductor, photonics and heterogeneous integration sectors. Further details and the registration form can be found via the link below.

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