Advanced packaging and heterogeneous integration are playing an increasingly significant role in the development of the European semiconductor industry. They make it possible to bring different technologies, functions and components closer together, thereby forming a vital link between research, application and market launch.
During the webinar, participants will gain an insight into APECS’s technologies and services in the field of advanced packaging and heterogeneous integration. The webinar will also explain how APECS collaborates with organisations such as the ChipNL Competence Centre to ensure that access to pilot lines is better aligned with national ecosystems.
Speakers
Laure de Tassigny (Minalogic) – Introduction to the aCCCess project
Félix Mohn (Research Fab Microelectronics Germany) – Introduction to the APECS Pilot Line & access strategies
Erik Jung (Fraunhofer) – APECS key technologies
Mark Luke Farrugia (ChipTech Twente / ChipNL CC) – How ChipNL CC connects the APECS Pilot Line to the Dutch ecosystem