Programme
Participants will visit leading companies and research institutes in the field of integrated photonics and advanced packaging. In addition to formal visits, the programme includes joint transport and networking dinners to encourage informal exchanges and long-term collaboration. The programme also includes exploring opportunities for collaboration with major German projects such as the APECS Fraunhofer Pilot Line.
Who is it for?
This innovation mission is aimed at Dutch entrepreneurs, researchers and innovators working in the semiconductor, photonics and heterogeneous integration sectors.
Further information and registration
Further information about the programme, the costs and registration can be found on the RVO website.