Chip-Packaging co-design for Dermal Biosensing

Research for new scalable processes for CGM biosensors.

Within the Bio-ChipPack project a novel, sustainable, and low-cost continuous glucose monitor (CGM) will be developed through the co-design of microneedle biosensors with 3D chip packaging. TU Delft and Sensible will research wafer-level, scalable processes for microneedle fabrication and 3D printing packaging that eliminate the use of PFAS and non-recyclable plastics. New nanostructured materials will be also investigated to improve the sensitivity and reliability of the CGM device while reducing the amount of noble metals used. Compared to existing CGMs, this new CGM will use 40 times less material, enable reusable electronics, and integrate end-of-life processing, drastically reducing e-waste. This innovation will reduce healthcare costs