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DELTAS

Deep Learning for Inverse Lithography and SEM Inspection

Microchips are made by building up layers of interconnected patterns on a silicon wafer. The manufacturing process involves hundreds of steps, done with nanometer precision. At the most cutting-edge, it requires EUV lithography.

New algorithms for reconstruction of wafers from (denoised) SEM images

To further develop advanced lithography, a combination of physical characteristics and data-derived algorithms establishes greater densities of chips. This project develops new efficient algorithms for sub-surface reconstruction of wafers from (denoised) SEM images that include physical models of the sub-surface reconstruction of wafers, and advanced deep generative models for stochastic mask prediction to optimize for worst-case performance (robust statistics) to achieve highly robust, yet performant, masks.

Facts & figures
  • Scheme: PPS-I Strategische Programma's
  • Programme: Semiconductor Manufacturing Equipment | 2024-2027
  • Total budgeted project costs: € 1.352.976,00
  • Project start date: 1 January 2025
  • Project end date: 31 December 2029
Project managers
Project consortium
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