3D integration technologies and sustainable systemic design techniques for next-gen semiconductor equipment
This KIC mission call is a collaboration between NWO and Holland High Tech. The call focuses on funding fundamental and applied research in the field of 3D integration technologies and sustainable systemic design techniques. The call is expected to open in Q4 of 2026.
Stimulate hightech research
The HTSM program is in line with our technological roadmaps and the National Technology Strategy (NTS). This strategy identifies key technologies that are needed in the upcoming transitions, such as the energy transition, the circular transition and the development of digitalization. This HTSM call stimulates research in the field of High Tech Systems and Materials in the Netherlands, in order to strengthen and expand the knowledge position of high tech in the Netherlands.
Focus on two key technologies
The semiconductor equipment industry faces two challenges in the coming years that are closely interconnected. On the one hand, the rise of 3D integration calls for new generations of mechatronic equipment. Extremely high precision, extensive integration of multiple process steps, and shorter development cycles are crucial for such equipment. At the same time, strict cost control remains essential, which can be ensured through modularity, scalable platforms, and integrated design-for-complexity approaches.
On the other hand, requirements related to sustainability and the availability of critical materials continue to increase. This demands new solutions for circular design, component reuse, and the reduction of strategic raw materials. It is important that no compromises are made in terms of reliability, uptime, and cost-effectiveness. Achieving this requires new design, testing, and lifecycle methodologies, supported by data and digital twins.
Budget en cofinancing
NWO and Holland High Tech are jointly making €6 million available for research proposals under this call for proposals.
It is mandatory to have two or more co-financiers participate in the project. The co-financiers must jointly contribute at least 20% of the total budget for the application. This can be in cash or in kind.
