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LSP-BOND

Light‑Speed Precision Bonding

This project develops a new laser-based, contactless integration technology for the next generation of AI chips. Replacing conventional mechanical assembly methods, it enables precise, low-impact integration of ultra-thin and fragile components, such as photonic chips and hybrid-bonded dies. The approach supports higher performance, lower power consumption and improved reliability in future AI hardware, while creating scalable paths to industrial adoption and advanced semiconductor packaging.

The growth of AI and the increasing dependence on intelligent systems

Artificial intelligence is increasingly used in everyday life, for example in chatbots, search engines, translation apps and image recognition. AI also plays an important role in systems that must work reliably and quickly, such as fraud detection, data centers and self-driving cars. These applications require fast decisions, few errors and low energy consumption. In the future, AI will become increasingly independent and work directly with the physical world, for example in factories, transport, energy supply and scientific research. As a result, the demands on the performance and reliability of AI hardware are increasing.

The growth of AI and the increasing energy challenge

The rapid growth of AI is causing a sharp increase in the number of computers and energy consumption. Data centers already use enormous amounts of electricity, and this is expected to increase much further by 2030, mainly due to AI applications. Many new data centers are therefore being built worldwide, with large investments from technology companies. This shows that the further growth of AI is increasingly limited by high energy consumption, and that new, more energy-efficient hardware is desperately needed.

Shift to advanced packaging

Modern AI chips increasingly use combinations of different components (computing, memory and communication chips) in one package. As it becomes increasingly difficult to make chips smaller, better performance per watt increasingly depends on smart packaging techniques. Technologies such as chiplets, 3D memory, advanced connections and interposers are therefore becoming increasingly important. With larger AI systems, moving data is often the biggest problem, making smart integration and packaging crucial for the next generation of AI hardware.

Facts & figures
  • Scheme: PPS-I Strategische Programma's
  • Programme: Advanced Chip Packaging | 2025-2027
  • Total budgeted project costs: € 875.000,00
  • Project start date: 2 March 2026
  • Project end date: 1 March 2027
Project managers
Project consortium
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