Advanced computational modelling of bonding and debonding processes for high-precision equipment

Enhancing Predictive Capabilities for High-Precision Bonding Processes

The project addresses the challenges in predicting bonding processes with high accuracy, focusing on the development of thermodynamically consistent models that describe small-scale bonding and debonding mechanisms. These models will incorporate advanced numerical methods and uncertainty quantification to improve predictive capabilities. The research will lead to high-fidelity models that enhance the understanding of bonding processes, reduce manufacturing errors, and improve the reliability of high-tech systems.

Collaboration

The project also aims to create a reduced-order model (ROM) for real-time process control and reliability assessment. The collaboration with industrial partners ensures the practical applicability of the models, contributing to the sustainability and efficiency of high-tech manufacturing.