Panel Level Advanced Packaging Enabled by Nanoimprint Lithography

Advancing Manufacturing Efficiency

Panel-level packaging uses large substrates to boost throughput and reduce costs. However, producing fine, high-density redistribution layers (RDLs) and interposers on these panels is technically challenging. This project focuses on developing NIL processes to create precise RDLs, integrating them with advanced metallization techniques to ensure reliable chip-to-chip connections

Project Ambition

A key goal is to build a working prototype that interconnects multiple chiplets using NIL-based RDLs. The project will also compare NIL’s technical and economic performance against traditional photolithography, assessing its benefits in terms of process simplification, material efficiency, and environmental impact. A business case analysis will evaluate NIL’s market potential.

Strengthening Dutch Innovation

By advancing NIL for panel-level packaging, the project positions Morphotonics to enter the advanced packaging market and strengthens the Netherlands’ role in the global semiconductor supply chain. The outcomes support Dutch innovation agendas and have broad applications in high-performance computing, AI, photonics, and biosensing—expanding the reach and impact of Dutch high-tech expertise.