Next-generation Heterogeneous Integration by data-enhanced Performance Optimization

Research and Development Activities

The project is divided into two work packages. WP1 will research a digital twin for hybrid bonding, combining physics-based and data-driven AI models to optimize mechatronic parameters and bonding quality. WP2 will enhance thermal management in thermo-compression bonding creating data-driven models and advanced control strategies. Both work packages involve in-depth fundamental research and experimental validation on industrial case studies and test setups of ASMPT.

Broader Impact and Expected Results

The N-HIPO project significantly contributes to the Dutch semiconductor ecosystem, aligning with national strategies and enhancing the Netherlands' leadership in key enabling technologies. Economically, it strengthens ASMPT's market position and supports the European semiconductor strategy for self-sufficiency. Intellectually, it fosters innovation and knowledge transfer between TU/e and industry.