Holland High Tech Holland High Tech
LIGHT2TAG

Light-assisted integration of NXTGEN Tag Chips

This project aims to make RFID technology faster, cheaper, and more scalable for use in food and beverage packaging. By developing light-assisted, contactless methods to place ultra-small RFID chips on flexible substrates, it overcomes current limitations in speed, cost, and reliability. The technology enables item-level traceability, safer supply chains, and more sustainable packaging, supporting the Netherlands’ position as a leader in smart, tech-enabled food systems.

RFID as a Driver for Safe and Sustainable Food Systems

Integrating RFID into the food and beverage sector represents a breakthrough in both technology and social responsibility. RFID enables item-level traceability, real-time data, and automation that enhance supply-chain transparency and safety. Growing consumer and regulatory demands for sustainable, traceable food systems make this innovation urgent. Without modernized tracking, producers face costly recalls, waste, and inefficiency. The project aligns with Dutch efforts in smart packaging, circular food systems, and digital agriculture.

Miniaturization and Cost Reduction as Enablers

RFID has proven its value in apparel, pharmaceuticals, and logistics but remains too expensive for high-volume, low-margin markets like food packaging. By reducing chip size from 250×360 µm² to 50×100 µm², the chip’s cost share drops from 69% to 53%, bringing the total inlay price below 1.5 euro cents. Miniaturization increases wafer yield, improves material efficiency, and enables compatibility with flexible substrates, making digital traceability economically viable in the FMCG sector.

Overcoming Bottlenecks and Expanding Applications

Current RFID assembly methods, such as pick-and-place and dispense-printing, are too slow and thermally incompatible with flexible packaging materials, limiting scalability. Even advanced systems like ITEC’s ADAT3 XF cannot meet the speed required for mass adoption. This project introduces laser-based, contactless integration, achieving sub-micron precision and over 300,000 units per hour. Beyond food and beverage, the method can be applied to advanced electronics, microLEDs, photonics, and semiconductor packaging, strengthening Dutch expertise in next-generation manufacturing.

Facts & figures
  • Scheme: PPS-I Strategische Programma's
  • Programme: Advanced Chip Packaging | 2025-2027
  • Total budgeted project costs: € 806.000,00
  • Project start date: 1 January 2026
  • Project end date: 1 July 2027
Project managers
Project consortium
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