ASPEA
Atomic-Scale Processing Equipment for the Ångstrom Era
The semiconductor manufacturing equipment industry is challenged to prepare its processing tools and associated processing library for the upcoming Ångstrom era of chips: precision at the atomic-scale will be required for fabrication of chips and new materials need to be introduced.
In this project, we address four key interrelated challenges for the deposition equipment domain, in collaboration with a world-leading supplier of atomic layer deposition equipment. The goal is to advance the atomic-scale processing toolkit in these four areas, in order to facilitate the development of deposition equipment for the next leap in scaling of state-of-the-art chips.