Workshop new materials & 3D packaging
The semiconductor equipment industry is facing interesting new innovations. One of the aspects that is of interest for our industry at the moment are new materials and 3D packaging.
On behalf of Joep Pijnenburg of ASML and leader of the HTSM roadmap semiconductor equipment, we invite you to the workshop “New Materials and 3D packaging” on Thursday, 11 March 2021. During this workshop, we will dive into these aspects in relation to the semiconductor equipment industry in the near and far future.
Date & Time
Thursday, 11 March 2021
13:30 – 18:00 hrs
More details regarding the program will follow soon.
Conference Center High Tech Campus
conference room Ernst
High Tech Campus 1
The Strip 5656 AE Eindhoven
Please park in P0
Registration will open soon. There is no participation fee for this workshop, but please sign up in advance.
This event is made possible by Holland High Tech MIT-regeling Netwerkactiviteiten